发明名称 |
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EMBEDDED COMPONENT AND METHOD OF MANUFACTURE THEREOF |
摘要 |
An integrated circuit packaging system, and a method of manufacture of an integrated circuit packaging system thereof, including: an embedding material on a component; a mask layer on the embedding material; a buried pattern in the mask layer, the outer surface of the buried pattern coplanar with the outer surface of the mask layer, the buried pattern electrically connected to the component; a patterned dielectric on a portion of the buried pattern; and an integrated circuit die on the buried pattern. |
申请公布号 |
KR20150070012(A) |
申请公布日期 |
2015.06.24 |
申请号 |
KR20140176103 |
申请日期 |
2014.12.09 |
申请人 |
STATS CHIPPAC LTD. |
发明人 |
JEON, DONG JU;PARK, KYOUNG HEE;ROH, YOUNG DAL;JUNG, JIN HEE |
分类号 |
H01L23/50 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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