发明名称 研磨パッド
摘要 PROBLEM TO BE SOLVED: To provide a polishing pad having improved dressing properties while hardness is maintained.SOLUTION: The polishing pad has a polishing layer formed of a polyurethane resin foam. The polyurethane resin foam contains, as starting material components, (A) an isocyanate component, (B) a polyol component, (C) an aromatic compound that has one hydroxyl group and/or an aromatic compound that has one amino group, and (D) hollow microspheres.
申请公布号 JP5738731(B2) 申请公布日期 2015.06.24
申请号 JP20110207635 申请日期 2011.09.22
申请人 发明人
分类号 B24B37/24;C08G18/65;H01L21/304 主分类号 B24B37/24
代理机构 代理人
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