发明名称 ヒートシンク用高熱伝導性樹脂成形体
摘要 <P>PROBLEM TO BE SOLVED: To provide a molded body excellent in high thermal conductivity, electrical insulation, low density, moldability, high light stability, high whiteness and the like, and having high reflectivity. <P>SOLUTION: The high thermal conductivity resin-molded body is obtained by molding a composition which contains at least a thermoplastic polyester resin and scale-like hexagonal boron nitride powders having the number-average particle size of &ge;15 &mu;m, whiteness of &ge;90 and graphitization index of &le;2.0 and has a volume ratio of the resin to the boron nitride powder of 85/15 to 25/75. The molded body has: a whiteness of &ge;80 as a molding; a thermal conductivity of &ge;1 W/m.K; a color difference &Delta;E, before and after irradiating a sample with light emitted from a 400W mercury lamp in an atmosphere at 120&deg;C continuously for seven days from 10 cm, of &le;10; and a surface electrical resistance value of &ge;1,011 &Omega;. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP5740097(B2) 申请公布日期 2015.06.24
申请号 JP20100094379 申请日期 2010.04.15
申请人 株式会社カネカ 发明人 片山 覚嗣;松本 一昭;野口 貴三郎
分类号 C08J5/00;C08K3/38;C08L67/02;C09K5/08 主分类号 C08J5/00
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