| 摘要 |
A high-frequency module (10) includes a first switch element (21) and a second switch element (22) that are mounted on a multilayer body (100). The first switch element (21) is equipped with a common terminal (Pc1) and individual terminals (Pi11, Pi12, Pi13 and Pi14). The second switch element (22) is equipped with a common terminal (Pc2) and individual terminals (Pi21, Pi22, Pi23 and Pi24). The individual terminals (Pi11, Pi12, Pi13, Pi21, Pi22 and Pi23) are connected to any of SAW filters (411, 412, 421 and 422) mounted on the multilayer body (100) or low loss filters (31 and 32) formed inside the multilayer body (100). The individual terminals (Pi14 and Pi24) are grounded by being connected to an inner layer ground electrode (DPG01) inside the multilayer body (100) by conductive via holes (131 and 132). |
