In-situ annealing for extending the lifetime of CMOS products

摘要

Methods for packaging a functional chip, methods for annealing a functional chip, and chip assemblies. A functional chip and an annealing chip are located inside a package. The functional chip includes an integrated circuit. The annealing chip includes an annealing element source comprised of an annealing element or a light source configured to emit electromagnetic radiation. The integrated circuit of the functional chip receives the annealing element, electromagnetic radiation, or both from the annealing chip in order to perform an annealing procedure that extends the useful lifetime of the packaged integrated circuit.

主权项

1. A method for packaging a functional chip including an integrated circuit, the method comprising:
forming, on an annealing chip, an annealing element source comprised of hydrogen as an annealing element or a light source configured to emit electromagnetic radiation, wherein the light source is formed on the annealing chip; forming a heater on the annealing chip; coupling the annealing chip with the functional chip for delivery of the electromagnetic energy from the light source to the integrated circuit of the functional chip; and placing the annealing chip and the functional chip inside of a package to form an assembly.