Semiconductor device

摘要

A semiconductor device includes an insulating circuit substrate mounted with at least one semiconductor element; a resin case having a bottom surface portion attached with the insulating circuit substrate and a side surface portion enclosing a periphery of the bottom surface portion; a lead molded integrally with the resin case and provided on a periphery of the insulating circuit substrate to be positioned on a surface of the bottom surface portion inside the resin case, the lead partially extending from inside the resin case to outside the resin case; and a sealing resin filled inside the resin case. A depressed portion is formed on two sides of the lead along a peripheral edge of the bottom surface portion inside the resin case.

主权项

1. A semiconductor device, comprising:
an insulating circuit substrate mounted with at least one semiconductor element; a resin case having a bottom surface portion attached with the insulating circuit substrate and a side surface portion enclosing a periphery of the bottom surface portion; a plurality of leads molded integrally with the resin case and provided parallel around a periphery of the insulating circuit substrate, the plurality of leads being positioned in the bottom surface portion inside the resin case so that an upper surface of the lead and a surface of the bottom surface portion are coplanar, and penetrating the side surface portion of the resin case to extend from inside the resin case to outside the resin case; and a sealing resin filled inside the resin case, wherein the resin case includes depressed portions formed in the bottom surface portion on each of two sides of each of the plurality of leads along a border between the bottom surface portion and the side surface portion to fill with the sealing resin.