发明名称 Method for laser cutting polycrystalline diamond structures
摘要 Methods of laser cutting polycrystalline diamond tables and polycrystalline diamond compacts are disclosed. Laser cutting of the polycrystalline diamond table provides an alternative to electrical-discharge machining (“EDM”), grinding with a diamond wheel, or lapping with a diamond wheel. Grinding or lapping with a diamond wheel is relatively slow and expensive, as diamond is used to remove a diamond material. EDM cutting of the polycrystalline diamond table is sometimes impractical or even impossible, particularly when the cobalt or other infiltrant or catalyst concentration within the polycrystalline diamond table is very low (e.g., in the case of a leached polycrystalline diamond table). As such, laser cutting provides a valuable alternative machining method that may be employed in various processes such as laser scribing, laser ablation, and laser lapping.
申请公布号 US9062505(B2) 申请公布日期 2015.06.23
申请号 US201113166007 申请日期 2011.06.22
申请人 US SYNTHETIC CORPORATION 发明人 Chapman Mark P.;Ward Ronald W.;Christensen Nicholas;Crockett Damon B.
分类号 E21B10/46;E21B10/567 主分类号 E21B10/46
代理机构 Dorsey & Whitney LLP 代理人 Dorsey & Whitney LLP
主权项 1. A method of shaping a polycrystalline diamond table (“PCD”), comprising: providing the PCD table, wherein the PCD table defines an exterior surface and includes a plurality of bonded diamond grains defining interstitial regions in which at least a portion thereof includes metal-solvent catalyst therein, the PCD table defining; applying laser energy to at least the exterior surface of the PCD table to remove diamond material adjacent to the exterior surface so as to form a groove that extends inwardly from the exterior surface; and breaking the PCD table along the groove.
地址 Orem UT US