Heat spreader for integrated circuit device

摘要

A BGA type packaged integrated circuit (IC) die has an exposed coronal heat spreader. The die, which is attached to a substrate, is encapsulated in a central segment of molding compound. The central segment is laterally surrounded by, and separated by a moat from a ring segment of molding compound, to a form a slot. The coronal heat spreader is inserted into the slot to cap the central segment. The coronal heat spreader is attached to the substrate and to the central segment with thermal glue. In operation, at least some of the heat generated by the die is dissipated through the coronal heat spreader.

主权项

1. A packaged integrated circuit (IC) device, comprising:
a substrate; a die attached to the substrate; a heat spreader having a lower segment and an upper segment; a central segment of molding compound encapsulating the die and attached to the substrate; a ring segment of molding compound attached to the substrate, wherein:
the central segment of molding compound is substantially separated from the ring segment of molding compound by the lower segment of the heat spreader; andthe upper segment of the heat spreader forms part of the exterior of the packaged device; and a mold gate attached to the substrate and connecting the ring segment of molding compound to the central segment of molding compound, wherein the lower segment of the heat spreader has a notch corresponding to the mold gate.