Die attached to a support member by a plurality of adhesive members

摘要

Methods and systems for adhering microfeature workpieces to support members are disclosed. A method in accordance with one embodiment of the invention includes disposing a first adhesive on a surface of a microfeature workpiece, and disposing a second adhesive on a surface of a support member. The method can further include adhesively attaching the microfeature workpiece to the support member by contacting the first adhesive with the second adhesive while the second adhesive is only partially cured. In further particular embodiments, the first and second adhesives can have different compositions, and the second adhesive can be fully cured after the microfeature workpiece and support member are adhesively attached.

主权项

1. A microfeature workpiece assembly, comprising:
a microfeature workpiece including a microelectronic die, the microfeature workpiece having a first major surface, a second major surface facing away from the first major surface, and an edge surface between the first and second major surfaces; a support member having a support surface facing toward the second major surface of the microfeature workpiece; an adhesive structure including
a wafer backside laminate directly attached to the second major surface at a first interface, the wafer backside laminate including a film substrate having opposing major surfaces and adhesive material attached to both of the opposing major surfaces, andan adhesive layer directly attached to the support surface of the support member at a second interface; and an electrical coupling extending between the microfeature workpiece and the support member, wherein
the wafer backside laminate and the adhesive layer are distinct structures bonded to one another, andthe adhesive structure is configured to preferentially fail at a location between the first and second interfaces.