发明名称 Method for manufacturing LED
摘要 A method for manufacturing an LED includes preparing a plurality of different kinds of slurries with a plurality of different kinds of phosphors, a binder, and a solvent, with prescribed weight ratios and viscosities; applying at least one slurry to a substrate LED while vaporizing the solvent instantaneously to form at least one thin layer; transferring the substrate LED to a drying device and drying the substrate LED; forming laminated layers of the plurality of kinds of slurries on the substrate LED; and finally drying and curing the binder to form a dried multilayer coating composed of thin layers of the plurality of kinds of slurries.
申请公布号 US9064979(B2) 申请公布日期 2015.06.23
申请号 US201214344706 申请日期 2012.09.04
申请人 Mtek-smart Corporation 发明人 Matsunaga Masafumi
分类号 H01L21/00;H01L33/00;H01L33/50 主分类号 H01L21/00
代理机构 Miles & Stockbridge P.C. 代理人 Miles & Stockbridge P.C.
主权项 1. A method for manufacturing an LED, characterized by comprising: a first step of preparing a plurality of different kinds of slurries with a plurality of different kinds of phosphors, a binder, and a solvent, the weight ratio of said phosphors and said binder being in the range between 1:3 and 10:1, the weight ratio of non-volatile components and said solvent being in the range between 4:1 and 1:4, and the viscosities of said plurality of kinds of slurries being in the range between 1 and 100 mPa·s; a second step of applying at least one kind of slurry to a substrate LED placed on a table heated to a temperature between 30° C. and 150° C. while vaporizing the solvent instantaneously to form at least one thin layer by relatively moving the substrate LED and a plurality of applicators in a coating booth while causing said plurality of kinds of slurries to move or circulate in the respective corresponding applicators to prevent said phosphors from sedimenting; a third step of transferring said substrate LED to a drying device and drying it every time one or a plurality of layers are formed to promote curing of the binder; a fourth step of forming laminated layers of the plurality of kinds of slurries on the substrate LED to which the processing of the third step has been applied, by said plurality of applicators; and a fifth step of finally drying and curing the binder to form a dried multilayer coating composed of thin layers of said plurality of kinds of slurries on a surface and a side surface of the substrate LED, the average layer thickness of at least one kind of slurry after drying being in the range between 3 and 15 micrometers in equivalent weight.
地址 Yokohama-shi, Kanagawa JP