Semiconductor module and a method for fabrication thereof by extended embedding technologies

摘要

The semiconductor module includes a carrier, a plurality of semiconductor transistor chips disposed on the carrier, a plurality of semiconductor diode chips disposed on the carrier, an encapsulation layer disposed above the semiconductor transistor chips and the semiconductor diode chips, and a metallization layer disposed above the encapsulation layer. The metallization layer includes a plurality of metallic areas forming electrical connections between selected ones of the semiconductor transistor chips and the semiconductor diode chips.

主权项

1. A semiconductor module, comprising:
a contiguous carrier comprising an upper surface, a lower surface and side faces connecting the upper surface to the lower surface; a plurality of semiconductor chips disposed on the contiguous carrier; an encapsulation layer disposed above the semiconductor chips, the encapsulation layer covering the upper surface and the side faces of the contiguous carrier; and a metallization layer disposed above the encapsulation layer, the metallization layer comprising a plurality of metallic areas forming electrical connections between selected ones of the semiconductor chips.