| 发明名称 | Wiring structure, droplet discharge head, and droplet discharge apparatus | ||
| 摘要 | A droplet discharge head includes: a vibrating plate on which first and second terminals are formed; a reservoir forming substrate bonded to the vibrating plate and including a first inclined surface as a side surface on which a first wiring electrically connected to the first terminal is formed and that is inclined to a plate surface; and a wiring substrate bonded to the vibrating plate and including a second inclined surface as a side surface on which a second wiring electrically connected to the second terminal is formed and that is inclined to a plate surface along the first inclined surface. | ||
| 申请公布号 | US9064782(B2) | 申请公布日期 | 2015.06.23 |
| 申请号 | US201414165667 | 申请日期 | 2014.01.28 |
| 申请人 | SEIKO EPSON CORPORATION | 发明人 | Yokoyama Yoshihiko |
| 分类号 | H01L23/48;H01L23/00;H01L51/00 | 主分类号 | H01L23/48 |
| 代理机构 | Harness, Dickey & Pierce, P.L.C. | 代理人 | Harness, Dickey & Pierce, P.L.C. |
| 主权项 | 1. A wiring structure comprising: a base substrate on which a first terminal and a second terminal are formed; a first wiring substrate bonded to the base substrate and including a first inclined surface on which a first wiring electrically connected to the first terminal is formed and that is at an acute angle to the base substrate; and a second wiring substrate bonded to the base substrate and including a second inclined surface on which a second wiring electrically connected to the second terminal is formed and that is inclined to the base substrate along the first inclined surface. | ||
| 地址 | JP | ||