Methods for minimizing edge peeling in the manufacturing of BSI chips

摘要

A method includes forming top metal lines over a semiconductor substrate, wherein the semiconductor substrate is a portion of a wafer having a bevel. When the top metal lines are exposed, an etchant is supplied on the bevel, wherein regions of the wafer sprayed with the etchant has an inner defining line forming a first ring having a first diameter. A trimming step is performed to trim an edge portion of the wafer, wherein an edge of a remaining portion of the wafer has a second diameter substantially equal to or smaller than the first diameter.

主权项

1. A method comprising:
forming top metal lines over a semiconductor substrate, wherein the semiconductor substrate is a portion of a wafer comprising a bevel; wherein the top metal lines are exposed, supplying an etchant to the bevel, wherein a region of the wafer supplied with the etchant has an inner defining line forming a first ring having a first diameter; and performing a trimming step to trim an edge portion of the wafer, wherein an edge of a remaining portion of the wafer has a second diameter substantially equal to or smaller than the first diameter.