发明名称 Manufacturing method of liquid ejecting head
摘要 Provided is a manufacturing method of a liquid ejecting head having a flow-path forming substrate in which a liquid flow path is provided to communicate with a nozzle opening through which liquid is discharged. The method includes performing wet etching on both surfaces of the flow-path forming substrate and forming the liquid flow path by removing a burr that is formed when the wet etching is performed on the flow-path forming substrate.
申请公布号 US9061501(B2) 申请公布日期 2015.06.23
申请号 US201414224019 申请日期 2014.03.24
申请人 Seiko Epson Corporation 发明人 Zhang Junhua
分类号 G01D15/00;B41J2/16;B41J2/14 主分类号 G01D15/00
代理机构 Kilpatrick Townsend & Stockton LLP 代理人 Kilpatrick Townsend & Stockton LLP
主权项 1. A manufacturing method of a liquid ejecting head having a flow-path forming substrate in which a liquid flow path is provided to communicate with a nozzle opening through which liquid is discharged, the flow-path forming substrate having a first surface opposite a second surface, the method comprising: masking the first surface with a first mask layer, the first mask layer having at least one opening; masking the second surface with a second mask layer, the second mask layer having at least one opening corresponding to the at least one opening of the first mask layer; performing wet etching on the first surface and the second surface of the flow-path forming substrate so as to form an opening between the first surface and the second surface, wherein the wet etching on the first surface and the second surface of the flow-path forming substrate results in a burr protruding inwardly from a side of the opening of the flow-path forming substrate after the completion of the wet etching of the flow-path forming substrate; and, after completion of the wet etching of the flow-path forming substrate, forming the liquid flow path by removing the burr that is formed after the wet etching is completed on the flow-path forming substrate.
地址 Tokyo JP