发明名称 Embossed micro-structure with cured transfer material method
摘要 A method of making an embossed micro-structure includes providing a transfer substrate, an emboss substrate, and an embossing stamp having one or more stamp structures. Transfer material is coated on the transfer substrate. The transfer material on the transfer substrate is contacted with the stamp structures to adhere transfer material to the stamp structures. A curable emboss layer is coated on the emboss substrate. The stamp structures and adhered transfer material are contacted to the curable emboss layer on the emboss substrate to emboss a micro-structure in the curable emboss layer and transfer the transfer material to the embossed micro-structure. The curable emboss layer is cured to form a cured emboss layer having embossed micro-structures corresponding to the stamp structures and having transfer material in the embossed micro-structures. The stamp structures is removed from the cured emboss layer, substantially leaving the transfer material in the micro-structure.
申请公布号 US9061463(B2) 申请公布日期 2015.06.23
申请号 US201313833244 申请日期 2013.03.15
申请人 EASTMAN KODAK COMPANY 发明人 Cok Ronald Steven;Nelson Shelby Forrester
分类号 H01S4/00;B29C59/02;H05K1/02;B29C35/08 主分类号 H01S4/00
代理机构 代理人 Owens Raymond L.
主权项 1. A method of making an embossed micro-structure, comprising: providing a transfer substrate, an emboss substrate, and an embossing stamp having one or more stamp structures; coating transfer material on the transfer substrate; contacting the transfer material on the transfer substrate with the stamp structures to adhere transfer material to the stamp structures; coating a curable emboss layer on the emboss substrate; contacting the stamp structures and adhered transfer material to the curable emboss layer on the emboss substrate to emboss a micro-structure in the curable emboss layer and transfer the transfer material to the embossed micro-structure; curing the curable emboss layer to form a cured emboss layer having embossed micro-structures corresponding to the stamp structures and having transfer material in the embossed micro-structures; and removing the stamp structures from the cured emboss layer, substantially leaving the transfer material in the micro-structure.
地址 Rochester NY US