Semiconductor chips having a dual-layered structure, packages having the same, and methods of fabricating the semiconductor chips and the packages

摘要

Dual-layered structural semiconductor chips are provided. The semiconductor chip includes a first semiconductor chip and a second semiconductor chip bonded to the first semiconductor chip. The first semiconductor chip includes a first substrate having a first bottom surface. The second semiconductor chip includes a second substrate having a second bottom surface. The first bottom surface directly contacts the second bottom surface. The related packages and the related methods are also provided.

主权项

1. A dual-layered structural semiconductor chip, the semiconductor chip comprising:
a first semiconductor chip including a first silicon substrate having a first bottom silicon surface; and a second semiconductor chip including a second silicon substrate having a second bottom silicon surface, wherein the first bottom silicon surface of the first silicon substrate directly contacts the second bottom silicon surface of the second silicon substrate.