Assembly and a chip package

摘要

An assembly (60) includes a substrate (1) that is provided with at least one electrical contact (3a), a flexible printed circuit membrane (51) including an electrically insulating film (6) and an electrically conducting layer (7) that is at least partially covering the insulating film (6). The conducting layer (7) is at least locally accessible from outside of the membrane (51). A connection element (10) is provided for electrically connecting the at least one electrical contact (3a) and the conducting layer (7) at a position where the conducting layer (7) is accessible, to form an electrical connection between the substrate (1) and the membrane (51). A chip package (70) includes a housing (15) having at least one electrically conducting terminal, and an assembly (60) as mentioned. The flexible printed circuit membrane (51) is arranged for electrically connecting the substrate and the at least one terminal of the housing (15).

主权项

1. An assembly comprising:
a substrate that is provided with at least one electrical contact, the substrate comprising a semiconductor substrate that comprises an opto-electronic device; a flexible printed circuit membrane comprising an electrically insulating film and an electrically conducting layer that is at least partially covering the insulating film, wherein the conducting layer is at least locally accessible from outside of the membrane, the conducting layer being a metal layer comprising a thin film of gold and/or copper, and a ball-shaped gold stud that is arranged using thermosonic bonding for electrically connecting the at least one electrical contact and the conducting layer at a position where the conducting layer is accessible, to form an electrical connection between the substrate and the membrane.