| 发明名称 |
Monitoring method for three-dimensional intergrated circuit (3D IC) and apparatus using the same |
| 摘要 |
A monitoring method of a three-dimensional integrated circuit (3D IC) is provided, wherein the method includes: providing a plurality of TSVs, providing a plurality of inverters; connecting the inverters with the plurality of TSVs as a circuit loop; enabling the circuit loop to oscillate; measuring an output signal on an output end of one of the plurality of inverters; and determining the manufacturing state of the plurality of TSVs of the 3D IC based on the output signal and apparatus using the same. |
| 申请公布号 |
US9064837(B2) |
申请公布日期 |
2015.06.23 |
| 申请号 |
US201213493976 |
申请日期 |
2012.06.11 |
| 申请人 |
Industrial Technology Research Institute |
发明人 |
Su Keng-Li;Lin Chih Sheng;Hsiao Chih-Wen |
| 分类号 |
G01R31/28;G01R13/00;H01L23/48;H01L21/66 |
主分类号 |
G01R31/28 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A monitoring method of a three-dimensional integrated circuit (3D IC), comprising:
providing a plurality of TSVs; providing a plurality of inverters; connecting the inverters with the TSVs in series as a circuit loop; enabling the circuit loop to oscillate; measuring an output signal on an output end of one of the plurality of inverters; and determining the manufacturing state of the plurality of TSVs of the 3D IC based on the output signal; wherein connecting the plurality of inverters with the plurality of TSVs further comprises:
dividing the plurality of TSVs into a plurality of TSV groups; andconnecting each one of the plurality of TSV groups with at least one inverter in series,wherein each of the TSV groups comprises at least one TSV, and the plurality of TSVs in each of the TSV groups are connected with each other. |
| 地址 |
Hsinchu TW |
