| 发明名称 |
Ultrasonic transducer assembly for applying ultrasonic acoustic energy to a glass melt |
| 摘要 |
An ultrasonic transducer assembly includes an ultrasonic transducer, an ultrasonic booster, an ultrasonic probe, and a booster cooling unit. The ultrasonic booster is connected to the ultrasonic transducer to amplify acoustic energy generated by the ultrasonic transducer and transfer the amplified acoustic energy to the ultrasonic probe. A seated end of the ultrasonic probe is positioned in a probe seat of the ultrasonic booster. The booster cooling unit is positioned to regulate the temperature of the probe seat of the ultrasonic booster such that the assembly supports a temperature dependent press-fit engagement of the seated end of the ultrasonic probe and the probe seat of the ultrasonic booster. The temperature dependent press-fit engagement is such that the seated end of the ultrasonic probe can be reversibly moved in and out of the probe seat at an elevated temperature THOT and is fixed in the probe seat at room temperature TCOLD. |
| 申请公布号 |
US9061928(B2) |
申请公布日期 |
2015.06.23 |
| 申请号 |
US201113036568 |
申请日期 |
2011.02.28 |
| 申请人 |
Corning Incorporated |
发明人 |
Boughton Daniel Robert;Jarvis Scott Michael;Kim Jonghak;Shi Zhiqiang |
| 分类号 |
B01F11/02;C03B5/18;C03B5/225 |
主分类号 |
B01F11/02 |
| 代理机构 |
|
代理人 |
Hood Michael A. |
| 主权项 |
1. An ultrasonic transducer assembly comprising an ultrasonic transducer, an ultrasonic booster, an ultrasonic probe, and a booster cooling unit, wherein:
the ultrasonic transducer generates acoustic energy at frequencies above approximately 15 kHz; the ultrasonic booster is connected to the ultrasonic transducer to amplify acoustic energy generated by the ultrasonic transducer and transfer the amplified acoustic energy to the ultrasonic probe; a seated end of the ultrasonic probe is positioned in a probe seat of the ultrasonic booster; the booster cooling unit is positioned to regulate the temperature of the probe seat of the ultrasonic booster such that the assembly supports a temperature dependent press-fit engagement of the seated end of the ultrasonic probe and the probe seat of the ultrasonic booster; and the temperature dependent press-fit engagement is such that the seated end of the ultrasonic probe can be reversibly moved in and out of the probe seat at an elevated temperature THOT and is fixed in the probe seat at room temperature TCOLD, wherein
TCOLD≦100° C.THOT−TCOLD≦300° C. |
| 地址 |
Corning NY US |
