Copper foil for printed wiring board

摘要

Provided is a copper foil for a printed wiring board, the copper foil being suitable for achieving finer pitch, favorable in terms of manufacturing cost, and excellent both in etching ability and adhesion to an insulating substrate. The copper foil for a printed wiring board comprises a copper foil base material and a covering layer for covering at least a portion of a surface of the copper foil base material, wherein the covering layer is formed by an nickel-vanadium alloy layer containing nickel and vanadium, and a chromium layer, laminated in this order from the surface of the copper foil base material; the chromium layer contains chromium in an amount of 15-210 μg/dm2; the nickel-vanadium alloy layer contains nickel and vanadium in a combined covering amount of 20-600 μg/dm2; and the nickel-vanadium alloy layer contains vanadium in an amount of 3-70 wt %.

主权项

1. A copper foil for a printed wiring board, comprising:
a copper foil base material; and a coating layer which coats at least a part of a surface of the copper foil base material, wherein the coating layer is formed of a Ni—V alloy layer containing Ni and V and a Cr layer, which are laminated in order from the surface of the copper foil base material, the Cr layer contains 15 μg/dm2 to 210 μg/dm2 of Cr, and the Ni—V alloy layer contains 20 μg/dm2 to 600 μg/dm2 of Ni and V in total in terms of coating amount, respectively, and the Ni—V alloy layer contains 3 wt % to 70 wt % of V.