Photolithography mask method for a wafer, method for producing same, and photolithography method for wafer using the same

摘要

A photolithography mask for a semiconductor wafer. The mask includes a protrusion section that protrudes from a handling section of the mask. An outer shape of the handling section enables handling by a mask aligner device. The protrusion includes a face surface provided at a level which is different from a face surface area of the handling section.

主权项

1. A photolithography mask for a semiconductor wafer, the mask comprising:
a handling section having an outer shape being provided for handling by a mask aligner; a protrusion section that protrudes from the handling section of the mask; and wherein a face surface of the protrusion section is provided at a level which is different from a face surface area of the handling section.