发明名称 |
Methods of forming isolation material on FinFET semiconductor devices and the resulting devices |
摘要 |
One method disclosed includes, among other things, forming an initial fin, covering a top surface and a portion of the sidewalls of the initial fin structure with etch stop material, forming a sacrificial gate structure above and around the initial fin structure, forming a sidewall spacer adjacent the sacrificial gate structure, performing at least one process operation to remove the sacrificial gate structure and thereby define a replacement gate cavity, performing at least one etching process through the replacement gate cavity to remove a portion of the initial fin structure so as to thereby define a final fin structure and a channel cavity positioned below the final fin structure, and substantially filling the channel cavity with an insulating material. |
申请公布号 |
US9064890(B1) |
申请公布日期 |
2015.06.23 |
申请号 |
US201414223545 |
申请日期 |
2014.03.24 |
申请人 |
GLOBALFOUNDRIES Inc.;International Business Machines Corporation |
发明人 |
Xie Ruilong;Cai Xiuyu;Cheng Kangguo;Khakifirooz Ali |
分类号 |
H01L29/66;H01L21/8238 |
主分类号 |
H01L29/66 |
代理机构 |
Amerson Law Firm, PLLC |
代理人 |
Amerson Law Firm, PLLC |
主权项 |
1. A method of forming a FinFET device, the method comprising:
forming an initial fin structure from a semiconductor substrate material, said initial fin structure having sidewalls; covering a top surface and a portion of said sidewalls of said initial fin structure with etch stop material; after forming said etch stop material, forming a sacrificial gate structure above and around said initial fin structure; forming a sidewall spacer adjacent said sacrificial gate structure; performing at least one process operation to remove said sacrificial gate structure and thereby define a replacement gate cavity, wherein said etch stop material on said initial fin structure remains positioned on said initial fin structure while said sacrificial gate structure is removed; performing at least one etching process through said replacement gate cavity to remove a portion of said initial fin structure positioned under said replacement gate cavity that is not covered by said etch stop material so as to thereby define a final fin structure and a channel cavity positioned below said final fin structure; and substantially filling said channel cavity with an insulating material. |
地址 |
Grand Cayman KY |