发明名称 Method for manufacturing light-emitting element, and light-emitting element
摘要 Provided are a method of manufacturing a light-emitting element by which a light-emitting element (80) is manufactured through the following steps and a light-emitting element manufactured by employing the method. A light-emitting element layer (40) is formed on one face (32T) of a monocrystalline substrate (30A) for a light-emitting element. Next, the other face (32B) of the monocrystalline substrate (30A) for a light-emitting element is polished until a state where a vertical hole (34A) penetrates the monocrystalline substrate (30A) for a light-emitting element in its thickness direction is established. Next, a conductive material is filled into the vertical hole (34B) from the side of the vertical hole (34B) closer to an opening (36B) in the other face (32B) to form a conductive portion (50) that is continuous from a side closer to the light-emitting element layer (40) to the opening (36B) in the other face (32B).
申请公布号 US9065032(B2) 申请公布日期 2015.06.23
申请号 US201214119694 申请日期 2012.04.03
申请人 NAMIKI SEIMITSU HOUSEKI KABUSHIKIKAISHA;DISCO CORPORATION 发明人 Aida Hideo;Aota Natsuko;Takeda Hidetoshi;Honjo Keiji;Hoshino Hitoshi
分类号 H01L21/00;H01L33/62;H01L33/00;H01L33/38 主分类号 H01L21/00
代理机构 Cantor Colburn LLP 代理人 Cantor Colburn LLP
主权项 1. A method of manufacturing a light-emitting element, comprising at least: a light-emitting element layer-forming step of forming a light-emitting element layer on one face of a monocrystalline substrate for a light-emitting element provided with a vertical hole having an opening only in the one face; a polishing step of polishing another face of the monocrystalline substrate for a light-emitting element until a state where the vertical hole penetrates the monocrystalline substrate for a light-emitting element in a thickness direction thereof is established after performing at least the light-emitting element layer-forming step; and a conductive portion-forming step of filling a conductive material into the vertical hole from a side of the vertical hole closer to an opening in the another face after performing at least the polishing step to form a conductive portion that is continuous from a side closer to the light-emitting element layer to the opening in the another face.
地址 JP