发明名称 Automated assembly method for the production of interconnected thin film solar cell modules
摘要 A method of manufacturing electrically interconnected solar cell assemblies, including the steps of: positioning at least a first interconnect element (64) in an alignment feature of a top carrier and facing a top surface of a first photovoltaic cell (60); adhering the first interconnect element to a location on the top surface of the first cell, wherein a length of the first interconnect element extends beyond a trailing edge (68) of the first cell; and adhering a portion of the length of the first interconnect element that extends beyond a trailing edge of the first cell to the bottom surface of a second cell (62). In one aspect, a system is provided for assembling solar cell strings, including cell transfer equipment, a bottom pallet including grooves, multiple top pallets including grooves, an adhesive dispensing system, a ribbon supply mechanism, and a system for moving ribbons and top pallets.
申请公布号 US9065008(B2) 申请公布日期 2015.06.23
申请号 US201113810356 申请日期 2011.07.29
申请人 Dow Global Technologies LLC 发明人 Degroot Marty W.;Ramesh Narayan;Sakuma Minoru;Charamut Dustin M.;Mills Michael E.;Perkon David J.
分类号 H01L31/18 主分类号 H01L31/18
代理机构 Kagan Binder, PLLC 代理人 Kagan Binder, PLLC
主权项 1. A method of manufacturing electrically interconnected solar cell assemblies, comprising the steps of: (a) providing a first photovoltaic cell; (b) positioning at least a first interconnect element in an alignment feature of a top carrier and facing a top surface of the first cell; (c) adhering the first interconnect element to a predetermined location on the top surface of the first cell, wherein a length of the first interconnect element extends beyond a trailing edge of the first cell; (d) prior to step (e), positioning a portion of the length of the first interconnect element that extends beyond the trailing edge of the first cell in a first alignment feature of a bottom carrier; (e) adhering a portion of the length of the first interconnect element that extends beyond a trailing edge of the first cell to a bottom surface of a second cell and adhering at least a portion of the length of the first interconnect element that is positioned in the first alignment feature of the bottom carrier to a predetermined location on the bottom surface of the second cell; (f) positioning at least one subsequent interconnect element in an alignment feature of a top carrier and facing a top surface of a last cell in a string of cells to which an interconnect element has been attached on its bottom surface; (g) adhering the at least one subsequent interconnect element to a predetermined location on the top surface of the last cell in the string to which an interconnect element has been attached on its bottom surface, wherein a length of the at least one subsequent interconnect element extends beyond a trailing edge of the last cell in the string of cells to which an interconnect element has been attached on its bottom surface; (h) positioning a portion of the length of the at least one subsequent interconnect element that extends beyond a trailing edge of the last cell in the string of cells to which an interconnect element has been attached on its bottom surface in a first alignment feature of a bottom carrier; and (i) adhering at least a portion of the length of the at least one subsequent interconnect element that is positioned in the first alignment feature of the bottom carrier to a predetermined location on the bottom surface of a cell that is located adjacent to the cell in the string that is attached to the last cell in the string of cells to which an interconnect element has been attached on its bottom surface, wherein the string of cells comprises the first cell and a final cell that is spaced furthest in the string from the first cell.
地址 Midland MI US