发明名称 Thermal pyrolytic graphite enhanced components
摘要 A thermally conductive composite material, a thermal transfer device made of the material, and a method for making the material are disclosed. Apertures or depressions are formed in aluminum or aluminum alloy. Plugs are formed of thermal pyrolytic graphite. An amount of silicon sufficient for liquid interface diffusion bonding is applied, for example by vapor deposition or use of aluminum silicon alloy foil. The plugs are inserted in the apertures or depressions. Bonding energy is applied, for example by applying pressure and heat using a hot isostatic press. The thermal pyrolytic graphite, aluminum or aluminum alloy and silicon form a eutectic alloy. As a result, the plugs are bonded into the apertures or depressions. The composite material can be machined to produce finished devices such as the thermal transfer device. Thermally conductive planes of the thermal pyrolytic graphite plugs may be aligned in parallel to present a thermal conduction path.
申请公布号 US9064852(B1) 申请公布日期 2015.06.23
申请号 US201113310947 申请日期 2011.12.05
申请人 The Peregrine Falcon Corporation 发明人 Hardesty Robert E.
分类号 B21D39/00;H01L21/48;H01L23/367 主分类号 B21D39/00
代理机构 代理人 Schneck Thomas
主权项 1. A thermally conductive composite material comprising: an aluminum or aluminum alloy member; discrete plugs of thermal pyrolytic graphite embedded within a plurality of apertures formed in the aluminum or aluminum alloy member; and an eutectic alloy interface produced by a process comprising a thin layer of silicon of an interface location of said aluminum or aluminum alloy member and said discrete plugs of thermal pyrolytic graphite and then using elevated temperature and pressure to bond said aluminum or aluminum alloy member and said discrete plugs of thermal pyrolytic graphite together at said eutectic alloy interface securing the plugs to the aluminum or aluminum alloy member and formed by the aluminum or aluminum alloy, the thermal pyrolytic graphite and silicon, total residual silicon material after elevated temperature diffusion bonding limited to a thin region of at most 50 microns around each graphite plug.
地址 Pleasanton CA US