SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device which can prevent a metal thin film resistive element from being connected to a lower distribution line; and which can achieve reduction in manufacturing time and reduction in mask preparation cost.SOLUTION: A semiconductor device comprises: first and second conductive etching stopper films 21, 22 formed at a distance from each other on a lower interlayer insulation film 8; a metal thin film resistive element 23 formed on the lower interlayer insulation film 8 so as to bridge both etching stopper films 21, 22; a first contact hole 27 formed on an upper interlayer insulation film 9 to pierce the upper interlayer insulation film 9 from the surface and pierce the metal thin film resistive element 23 until reaching the first etching stopper film 21; and a second contact hole 28 formed on the upper interlayer insulation film 9 to pierce the upper interlayer insulation film 9 from the surface and pierce the metal thin film resistive element 23 until reaching the second etching stopper film 22.