| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which removes an alien substance or an oxide layer on an outer surface of a substrate, and to provide a substrate processing method.SOLUTION: A substrate processing apparatus according to one embodiment of the invention includes: a tray on which a substrate is loaded; a carry-in unit which carries in the tray on which the substrate that has not been subject to plasma treatment is loaded; a jig in which the tray is positioned at an upper part; a load port in which the jig stands ready; a plasma treatment unit in which the tray and the jig are carried in and the plasma treatment is performed to the substrate; and a carry-out unit which carries out the tray on which the substrate that has been subject to the plasma treatment is loaded. |
