发明名称 DIELECTRIC MATERIAL FOR TEMPERATURE COMPENSATION AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a dielectric material for temperature compensation, high in a dielectric constant and a temperature compensation rate, capable of not only optimizing the temperature compensation of a piezoelectric ultrasonic sensor in a wide range of temperature and downsizing a temperature compensation element but also avoiding the use of lead, and a method for manufacturing the dielectric material for temperature compensation.SOLUTION: The dielectric material for temperature compensation has a composition represented by the following formula. The method for manufacturing the dielectric material for temperature compensation comprises the steps of: mixing BaCO3, TiO2, SnO2, La2O3 and MgO and a raw material selectively including SrCO3 by the composition ratio of the following formula to obtain a mixture; and sintering the mixture at a temperature of 1280-1360°C for 1-3 hours. (BaSrMgLa)(TiSn)O(where, a is 0&le;a<0.20, b is 0<b<0.05, c is 0<c<0.01, and x is 0<x<0.20.)
申请公布号 JP2015113279(A) 申请公布日期 2015.06.22
申请号 JP20140182343 申请日期 2014.09.08
申请人 HYUNDAI MOTOR COMPANY CO LTD;DONG IL TECHNOL LTD 发明人 OH SUN MI;SOHN HYUN-SOO;KIM YOUNG MIN
分类号 C04B35/468;H01B3/12;H01L41/187;H01L41/43 主分类号 C04B35/468
代理机构 代理人
主权项
地址