| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer processing method capable of dividing a wafer into individual chips with excellent processing quality, while achieving enhancement of productivity and cost reduction. ! SOLUTION: A wafer processing method is a method for dividing a wafer, where multiple chips are formed in the regions sectioned by dividing lines of a device layer formed on the surface of a semiconductor substrate, into individual chips along the dividing lines, and includes a grooving step for removing the device layer in the dividing lines from the surface side of the wafer where the device layer is formed, by irradiating along the dividing lines with laser light guided by a liquid beam, and grooving the semiconductor substrate, and a back processing step for thinning the wafer by processing the back of the wafer. ! COPYRIGHT: (C)2015,JPO&INPIT |
