发明名称 DETERGENT COMPOSITION FOR REMOVING SOLDER FLUX RESIDUE
摘要 PROBLEM TO BE SOLVED: To provide a detergent composition for flux, which is suitable for cleaning a flux residue remaining in gaps between soldered components. ! SOLUTION: The detergent composition for removing a solder flux residue, in one or a plurality of embodiments, contains a (poly)ethylene glycol monoalkyl ether (component A) represented by formula (I), an alkanolamine (component B) represented by formula (II), an alkylbenzene sulfonic acid and/or a salt thereof (component C) having 1 to 6 carbon atoms, and water (component D), the content of component A being 88.0 mass% to 94.4 mass%, the content of diethylene glycol monobutyl ether in component A being 90.0 mass% to 100.0 mass%, the content of component B being 0.3 mass% to 5.0 mass%, and the content of component C being 0.3 mass% to 5.0 mass%. ! COPYRIGHT: (C)2015,JPO&INPIT
申请公布号 JP2015113379(A) 申请公布日期 2015.06.22
申请号 JP20130255150 申请日期 2013.12.10
申请人 KAO CORP 发明人 OHASHI HIDEMI ; KAWASHITA KOICHI
分类号 C11D7/50;B08B3/08;C11D1/72;C11D3/43;C11D7/32;C11D7/34;C23G5/036 主分类号 C11D7/50
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