| 摘要 |
PROBLEM TO BE SOLVED: To provide methods for evaluating and selecting a laminate plate that has high flexural strength and elasticity, is excellent in handleability, and is suitable for a semiconductor package and printed wiring board. ! SOLUTION: In a method for evaluating the mechanical characteristic of a thin-plate material, the mechanical characteristic is evaluated by measuring the strength or bending elastic modulus of the thin-plate material by a three-point bending test in which a test piece of the thin-plate material is placed on two support points arranged at a fixed distance and load is applied to one point in the center between the support points. The three-point bending test of the thin-plate material is performed by the test piece and measurement conditions in the following formulas (1) to (4), and the strength (the maximum bending stress) or bending elastic modulus of the thin-plate material is evaluated by the formulas (5) and (6): (1) 0.05≤t<0.8, t is the thickness of a test piece (mm); |
