| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing peeling of a semiconductor element from a base material when the semiconductor is mounted on a circuit board.SOLUTION: A semiconductor device includes: a base material 11; a semiconductor element 3 disposed on the base material 11; a resist layer 2 formed on the base material 11; and a sealing resin part 5 which covers the semiconductor element 3 and the resist layer 2. Multiple recessed parts 23 are formed on the resist layer 2 and parts of the sealing resin part 5 fill the multiple recessed parts 23. |
