发明名称 MOLDING DIE AND RESIN MOLDING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a molding die that can prevent resin leakage from an air vent part and ensure sufficient curing time of a resin charged into a cavity by disposing a metal film layer having a thermal conductivity higher than that of a die base material or a different member having a thermal conductivity on an outer periphery of a resin seal part. ! SOLUTION: A movable air vent piece 16 that can open and close an air passage is installed so as to face an air vent groove 2f for releasing air from a cavity recess 2a. The movable air vent piece 16 is formed with a metal film layer 17 having a thermal conductivity higher than that of a die base material or a different member having a thermal conductivity, on its end surface facing the air vent groove 2f. ! COPYRIGHT: (C)2015,JPO&INPIT
申请公布号 JP2015112762(A) 申请公布日期 2015.06.22
申请号 JP20130255261 申请日期 2013.12.10
申请人 APIC YAMADA CORP 发明人 SAITO TAKASHI
分类号 B29C45/34 主分类号 B29C45/34
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