| 摘要 |
PROBLEM TO BE SOLVED: To inhibit warpage of a substrate due to a stress generated between an insulation film which covers a coil and the substrate in a semiconductor device in which the coil is arranged on one surface side of the substrate.SOLUTION: In a semiconductor device, an insulation film 30 is arranged to wind a coil 20 when viewed from a normal direction with respect to one surface 10a of a substrate 10, regions in a coil formation region in the substrate 10, which are located on the inside and the outside of the coil 20 are made to be exposed. With this configuration, a stress generated between the insulation film 30 and the substrate 10 can be reduced at a part of the one surface 10a of the substrate 10, which is exposed from the insulation film 30 thereby to inhibit warpage of the substrate 10. |
