发明名称 MOLDING MATERIAL, MOLDING METHOD, MOLDING OBJECT, AND MOLDING APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To provide a molding method capable of stably molding even if a powder material is used as a material for molding a three-dimensional solid model, without scattering or dispersion of the powder and without affecting a molding apparatus and molding environment.SOLUTION: A molding apparatus 100 includes a heating section 20, a spreading section 30, a molding section 40, a drawing section 50 and a curing section 60. The heating section heats a molding material 1 including particles 2a and a binder agent 3 which bonds together the particles 2a, to a temperature equal to or higher than a melting point of the binder agent 3 and forms a fluid molding material 4. The spreading section forms a molding layer 5 by spreading the fluid molding material 4. The molding section has the molding layers 5 laminated thereon. The drawing section applies UV ink 8 to a desired region of the laminated molding layer 5. The curing section cures the UV ink 8 applied to the desired region of the molding layer 5.</p>
申请公布号 JP2015112751(A) 申请公布日期 2015.06.22
申请号 JP20130254767 申请日期 2013.12.10
申请人 SEIKO EPSON CORP 发明人 HIRATA KOKI
分类号 B29C67/00 主分类号 B29C67/00
代理机构 代理人
主权项
地址