| 摘要 |
PROBLEM TO BE SOLVED: To push up a semiconductor wafer without causing the bounce or misalignment of a ring frame, when the ring frame adhering to an adhesive tape along with the semiconductor wafer is pushed up from a vacuum chuck device by means of a push-up pin. ! SOLUTION: A vacuum chuck device includes a suction pad 62 composed of a porous material and vacuum sucking a work, a chuck body 64 to which the suction pad 62 is attached coaxially, and a plurality of magnets 66 for fixing a ring frame 104 are embedded in the outer periphery thereof, and ring frame push-up means consisting of a plurality of push-up pins 75 for pushing up the ring frame 104 while resisting against the magnetic force of the magnets 66, and an actuator for driving the push-up pins. A vacuum pad 82 for vacuum sucking the ring frame 104 is provided at the upper end of the push-up pin 75. ! COPYRIGHT: (C)2015,JPO&INPIT |
