| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board including a resin insulation layer and a conductor layer which are high in adhesion with an upper layer.SOLUTION: A resin modified layer 82A and a conductor modified layer 84A are formed by means of μ wave plasma processing on a first resin insulation layer 50A and a first conductor layer 58A, so that adhesion between the first resin insulation layer 50A and the first conductor layer 58A, and an upper second resin insulation layer 50B is improved via the resin modified layer 82A and the conductor modified layer 84A. |
