发明名称 HEATING ELEMENT ACCOMMODATION DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a heating element accommodation device capable of reducing a temperature difference (temperature variation) between the air inlet side and the air outlet side of a heating module.SOLUTION: A heating element accommodation device includes a first side face, a second side face, a first shelf board, second shelf boards, a module case and an excellent heat conductive member. The first side face has an air inlet for introducing outside air. The second side face is disposed oppositely to the first side face and has an air outlet in an upper part. The first shelf board is provided at the lower side of the air outlet and has an opening. The second shelf boards are disposed at the upper side of the air inlet while interposing a predetermined interval therebetween in a height direction and has openings. The module case is a substantially rectangular parallelepiped and fixed to the second shelf board of each height while turning its length direction in an air flowing direction. The excellent heat conductive member is fixed by abutting a heat transfer face on at least one side face of the module case in the length direction and abutting a side part of the heat transfer face on the second shelf boards.
申请公布号 JP2015115167(A) 申请公布日期 2015.06.22
申请号 JP20130255926 申请日期 2013.12.11
申请人 TOSHIBA CORP 发明人 NAKAHAMA YOSHIFUMI ; KUROKAWA TAKEYA
分类号 H01M10/60;H01M2/10;H05K7/18;H05K7/20 主分类号 H01M10/60
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