| 摘要 |
PROBLEM TO BE SOLVED: To provide an SnAgCu-based solder powder and a solder paste using the powder which is excellent in melting property upon reflow and wetting property in the fine solder powder suitable for the solder paste which provides a fine pitch. ! SOLUTION: An SnAgCu-based solder powder has an average particle size of 5 μm or less and is made by attaching dried material of a solution of nicotinic acid as an additive to the surface of solder powder. Preferably, the content proportion of silver is 0.1 to 10 mass% with respect to 100 pts.mass of content total amount of Sn, Ag, Cu contained in solder powder, the content proportion of Cu is 0.1 to 2.0 mass%, addition amount of the additive is 0.01 to 1.0 pts.mass and remainder comprises Sn. Further, the SnAgCu-based solder powder contains at least one kind of Bi, Ge, Ni and In by 1.0 mass% or less when the total solder powder is 100 mass%. ! COPYRIGHT: (C)2015,JPO&INPIT |
