| 摘要 |
PROBLEM TO BE SOLVED: To provide a coating film formation method and a coating film formation device capable of forming continuously, stably and repeatedly a coating film having a uniform film thickness on a circular substrate by using a slit die, while maintaining a far higher coating liquid utilization rate than a spin coat method. ! SOLUTION: In a coating film formation method, a mask material with a thickness of 50 μm or less having a similar figure to a substrate and a smaller opening part than the substrate is placed on the substrate so that the opening part is opened only to the upside of the substrate, and after forming each film of coating liquid having approximately the same thickness on the substrate exposed to the opening part and on the mask material, the film of the coating liquid formed on the mask material is removed together with the mask material. ! COPYRIGHT: (C)2015,JPO&INPIT |
