METAL MEMBER WITH Ag BASE LAYER, INSULATION CIRCUIT BOARD, SEMICONDUCTOR DEVICE, INSULATION CIRCUIT BOARD WITH HEAT SINK, AND METHOD OF MANUFACTURING METAL MEMBER WITH Ag BASE LAYER

摘要

PROBLEM TO BE SOLVED: To provide a metal member with an Ag base layer having excellent joining strength between a metal member and an Ag base layer and capable of securing electrical conductivity and thermal conductivity, and to provide an insulation circuit board composed of the metal member with the Ag base layer, a semiconductor device and an insulation circuit board with a heat sink each using the insulation circuit board, and a method of manufacturing the metal member with the Ag base layer. ! SOLUTION: The metal member with an Ag base layer is provided which includes: a metal member joined to a body to be joined; and an Ag base layer 30 formed on the surface of the metal member. On the joint surface joined to the body to be joined, of the metal member, a copper layer is formed which is made of copper or copper alloy. On the surface of the copper layer, the Ag base layer is formed. The Ag base layer 30 has a structure in which a plurality of Ag particles 31 are connected together by an intermetallic