发明名称 HEAT RADIATOR
摘要 PROBLEM TO BE SOLVED: To provide a heat radiator having a ceramic insulative layer, an aluminum circuit layer and a stress relaxation layer brazed together, and arranged to reduce the influence of a stress produced by the difference between the ceramic and aluminum in linear expansion coefficient. ! SOLUTION: A heat radiator 1 comprises: a ceramic insulative layer 11; an aluminum circuit layer 12 brazed on one side of the ceramic insulative layer 11 by an Al-Si based brazing filler metal; an aluminum stress relaxation layer 13 brazed on the other side by the Al-Si based brazing filler metal; and a heat sink 20 to which the stress relaxation layer 13 is brazed. Of at least one of a brazing filler metal layer 30 remaining between the insulative layer 11 and the circuit layer 12, and a brazing filler metal layer 31 remaining between the insulative layer 11 and the stress relaxation layer 13, a center portion in a cross section perpendicular to a direction of the layer thickness has a Si particle areal percen
申请公布号 JP2015115333(A) 申请公布日期 2015.06.22
申请号 JP20130253782 申请日期 2013.12.09
申请人 SHOWA DENKO KK 发明人 MINAMI KAZUHIKO
分类号 H01L23/36 主分类号 H01L23/36
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