| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus excellent in workability and maintainability.SOLUTION: The semiconductor manufacturing apparatus includes: a first transfer part for taking a tray out of a tray storage/supply part for storing the tray on which an unshielded semiconductor package to be subjected to electromagnetic wave shield is mounted, placing the tray on a transfer carrier, and transferring the transfer carrier to a spatter device performing bonding of spatter material for electromagnetic wave shielding; a second transfer part for taking the transfer carrier on which a tray where the electromagnetic shield-subjected semiconductor package is mounted, from the spatter device and transferring the carrier, collecting the tray on which the electromagnetic shield-subjected semiconductor package is mounted, from the transfer carrier, and storing the tray in the tray storage/supply part. |
