发明名称 SUBSTRATE CUTTING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a substrate cutting method capable of improving quality of a cutting surface of a substrate, and capable of remarkably improving a production yield of a reinforced glass cell for protecting a touch screen or a display panel of a portable terminal.SOLUTION: A Bessel beam B having the length of a thickness or more of a substrate 10 trying to be cut, is molded, and is irradiated to the substrate so that the substrate is positioned within the length of the Bessel beam, and the substrate or the Bessel beam is moved in the horizontal direction along a cutting schedule line of the substrate. The substrate cutting method is constituted so that Bessel beam molding is molded in the Bessel beam in a position separated from a condenser lens while being converged by the condenser lens by emitting a laser beam incident on an incident surface of a concave axicon lens from an emitting surface of the concave axicon lens, by using the concave axicon lens 120 having a depressed conical emitting surface and the condenser lens for converging the laser beam passed through the concave axicon lens.
申请公布号 JP2015112644(A) 申请公布日期 2015.06.22
申请号 JP20140232569 申请日期 2014.11.17
申请人 LTS CO LTD 发明人 PARK HON-JIN;SUH JONG HYUN;YOO SEUNG HYUP;KIM YEONG GYU;YU HUI JAE
分类号 B23K26/38;B23K26/00;B23K26/067;B23K26/073;B28D1/22;C03B33/09 主分类号 B23K26/38
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