| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition which shows excellent compatibility between a main agent and a curing agent and can give a cured product having excellent heat resistance and toughness, and an encapsulation material using the composition, and an electronic device product using the encapsulation material.SOLUTION: The curable resin composition comprises: a main agent comprising a maleimide compound and/or an epoxy compound; an amine curing agent; and a phenolic curing agent. An encapsulation material 11 comprises a cured product of the above composition, and an electronic device product 1 uses the encapsulation material. The amine curing agent comprises an aromatic polyamine. The phenolic curing agent comprises phenol having a phenolic OH equivalent of 90 or less and a softening point or a melting point of 100°C or lower. |
