| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface mounted component which allows for reduction in a range for forming solder paste on a wiring board, and to provide a manufacturing method therefor. ! SOLUTION: In a surface mounted component 10, a connector 14 is mounted, as a surface mounted component, on a wiring board 12. A plurality of terminals 12D are arranged on the side of the wiring board 12, and one terminals 12D are arranged closer to the connector 14 side than the other terminals 12D. A plurality of lead terminals 18A-18L are led out from the connector 14, and the tips thereof 20E, 22E, 24F are connected with a plurality of corresponding terminals 12D via a solder 26. The plurality of lead terminals 18A-18L are formed as one type having uniform heat capacity. ! COPYRIGHT: (C)2015,JPO&INPIT |
