| 摘要 |
PROBLEM TO BE SOLVED: To split a wafer, in which a modified layer is formed, efficiently and to remove the split waste without blowing away a chip.SOLUTION: A wafer 20 in which a modified layer is formed along a scheduled split line is mounted on a mounting table 12, and the wafer 20 mounted on the mounting table 12 is submerged into the cleaning water 30 in a water tank 13. An ultrasonic sound supply section 14 supplies ultrasonic sound to the wafer 20 submerged into the cleaning water 30. A plurality of chips are produced by splitting the wafer 20 into small pieces along a scheduled split line with the ultrasonic sound supplied by the ultrasonic sound supply section 14, and then the chips thus produced are cleaned. |
