| 摘要 |
PROBLEM TO BE SOLVED: To provide a module which enables downsizing while maintaining high airtightness of a device chip, and to provide a manufacturing method of the module. ! SOLUTION: A module includes: a substrate 10; a device chip 24 which is mounted on the substrate 10 in a flip chip method; a chip component 26 mounted on the substrate; a plate-like member 40 provided on the device chip and the chip component, the plate-like member 40 including the side of the device chip and chip component formed by an insulator; and a sealing metal 20 which is provided on the substrate and seals the device chip and the chip component with the plate-like member so that gaps are formed on a lower surface of the device chip and periphery of the chip component. ! COPYRIGHT: (C)2015,JPO&INPIT |
