| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a semiconductor device assembly method, which can fill a gap between a semiconductor module and a cooler with a thermal grease without leaving air at the time of assembly. ! SOLUTION: A semiconductor device comprises: a heat sink 20 for cooling semiconductor modules 30, 31, 32; thermal greases 40, 41, 42 filled in a gap between the semiconductor modules 30, 31, 32 and the heat sink 20; and a blade spring 60 for pushing the semiconductor modules 30, 31, 32 to the heat sink 20. Perforated seal members 50, 51, 52 enclose a filled part of the thermal greases 40, 41, 42 between the semiconductor modules 30, 31, 32 and the heat sink 20. ! COPYRIGHT: (C)2015,JPO&INPIT |
