| 摘要 |
PROBLEM TO BE SOLVED: To prevent contamination of a holding table and the like caused by a softened encapsulation layer extending off a semiconductor substrate in a process of adhering an encapsulation sheet with the semiconductor substrate. ! SOLUTION: Between a holding surface of an encapsulation sheet T on which a release liner having the same shape as the encapsulation sheet T is attached and a pressing member 35, a first cover film F1 larger than the encapsulation sheet T and having air permeability is interposed, and the encapsulation sheet T is sucked and held by the pressing member 35. Between a holding table 37 and a substrate W, a second cover film F2 larger than the substrate W and having air permeability is interposed, and the substrate W is held by the holding table 37. In this state, the substrate W and the encapsulation sheet T are positioned opposite each other, and the encapsulation sheet T is adhered to the substrate W while being heated. ! COPYRIGHT: (C)2015,JPO&INPIT |
